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Tantalum Sputtering Target

Brand :Xinkang

Product origin :Hunan,China

Delivery time :1-3 weeks

Supply capacity :1-2 tons / month

Tantalum Sputtering Target is produced by EB melting. It's usually applied for magnetic recording media, printer components, flat panel displays, optic, industrial glass, and thin film resistors. High purity Tantalum Sputtering Target is normally used for semiconductor application. Tantalum's high natural strength with its low thermal expansion coefficient, together with its ability to stick to both copper and silicon make it the perfect choice for a diffusion barrier to prevent copper and silicon from interacting. With up to 4N5 purity, uniform grain size, lower gas content, end user can obtain constant erosion rates as well as high purity and homogeneous thin film coating during PVD process.



Chemical Composition: pure Ta

Available Purity: 3N5, 4N5

Production Technology: EB Melting

Shapes: planar targets

Average Grain Size: < 100um


Certificate of analysis of 3N5 pure Tantalum Sputtering Target

 Certificate of analysis for 99.95% tantalum sputtering target.jpg


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